VTT is looking for a research scientist or research engineer for 3D integration with a background in semiconductor device fabrication, in a team developing “more than Moore” components such as CMOS integrated 2D sensors, in-memory analog computing and post-CMOS 3D integration.
The role
- Develop and characterize processes for monolithic and heterogeneous integration for post-CMOS integration.
- Solve complex fabrication challenges.
- Communicate and solve problems in close collaboration with others at VTT, and take part in concept development.
Requirements
- Experience in semiconductor process integration and 3D technologies.
- MSc or PhD in physics, electronics or a closely similar field.
- Experience in cleanroom fabrication.
- Excellent communication skills in English (required). The ad is in English and states no Finnish requirement. A security clearance procedure is part of the recruitment.
About the employer
VTT is one of the leading applied research organisations in Europe, with over 2,300 people, working at the interface of academia and industry; its infrastructure includes Micronova, the Finnish research infrastructure for micro-, nano- and quantum technologies. Permanent, full-time, work address Tietotie 3.
Salary and deadline
The ad states no salary; send the CV with your salary request through the recruitment system. Application deadline: 15 November 2026, as soon as possible.
Source: VTT, “Research Scientist/Engineer, Semiconductor Process Integration and 3D Technologies”, read on 25 October 2026. Summary by AVIDE; see the original page for the full, current text.